ECSI (Electrochemical Systems, Inc.) makes tools that work.
We design, build and supply efficient, precision benchtop wet processing
equipment for electroplating, electroforming, electrocleaning and etching
of metal microelectromichanical sytems (MEMS) and high density interconnects
(HDI) in academic, R&D and manufacturing applications. FIBRotools
are ideally suited for optimized electroplating of wafers and wafer
sections in semiconductor, MEMS, NANO and advanced high density interconnects
and electronics packaging fabrication.
Our objective is to make wet processing practical. Our tools liberate
researchers and manufacturers from the relative haphazardness of conventional
systems. MEMS, Wafers and High Density Interconnects electroplating
and electroforming with our equipment is predictable, easy and affordable.
What enables us to do this at a low cost is our proprietary FIBRo
-- fiber-initiated boundary-layer removal -- technology. Complemented
by our advanced wafer-holder design, FIBRo produces uniformity,
eliminates bubbles and minimizes edge effect. FIBRo is based on
discoveries by our founder and CEO, Igor V. Kadija, in the physicochemical
hydrodynamics of wet processing. FIBRo is covered by three US
patents with worldwide patent coverage. A flexible design in essence
FIBRo™ enables valuable upgrades when desired.
seedless electroplating on Si
under magnetic field