ECSI (Electrochemical Systems, Inc.) designs, builds and supplies efficient, precision benchtop equipment for electroplating of MICRO- and NANO-structures. FIBRotools™ are ideally suited for optimized electroplating of MEMS, NANO, and advanced high-density interconnects (HDI) on wafers and wafer sections in academic, R&D and manufacturing applications.

FIBRotools™ make wet processing practical. Our unique technology gives researchers and manufacturers an unmatched level of control over the plating process, making electroplating of MEMS, NANO and HDIs predictable, easy and affordable.

What enables us to do this at a low cost is our proprietary FIBRo™ -- Fiber-Initiated  Boundary-layer Removal -- technology. Complemented by our advanced wafer-holder design, FIBRo™ produces uniformity, eliminates bubbles and minimizes edge effects. FIBRo™ is based on the work of our founder and CEO, Igor V. Kadija, whose discoveries in the physicochemical hydrodynamics of wet processing were awarded three US patents with worldwide patent coverage.

Flexible and adaptable to many different process configurations, FIBRo™ enables fast track R&D in design advancements of a wide variety of MEMS, NANO, and HDI devices. Click here to find out more about our products and add-on options.

IKO Jr. 1 Gal 4" Wafer Plater