This is electrochemistry, not rocket science: get the metal from the solution to the cathode with a uniform thickness. Theoretically, plating can be done right in one try, not ten. But, you have thousands of nasty variables to contend with. What we've done is eliminate many of those variables, and found ways to control others. We focused mainly on where the actual plating occurs: the interface's boundary layer. And, with a little innovation, we mastered it.

How? ECSI's proprietary FIBRo™ (fiber-initiated boundary removal) process utilizes a unique fibrilic applicator to agitate and effectively reduce the boundary layer by up to 90%. Process control extends to the interface. You achieve uniformity, like clockwork. Simple. Practical. Repeatable.