The IKo™ TWIN-STATION™ is a self-contained, complete plating system with two entirely separate IKo™ CLASSIC modules for MEMS and NANO fabrication,including wafer installation, cleaning and activation with DI rinsing and Nitrogen gun section. Easily retrofitted in a cleanroom environment.

  • micro/macro uniformity <5% across the wafer
  • superior process control for mil size and nano structures
  • low purchase and operating costs
  • simultaneously processing two wafers of any size and shape (2 cm2 to 8")
  • identical hydrodynamics for all sizes and shapes if needed
  • two wafer cleaning and plating preparation sections
  • extremely fast -- typically, 1µ per minute
  • uses off-the-shelf chemistries with minimal additives
  • efficiently reuses chemical solution
  • easy to use/maintain

The IKo™ TWIN-STATION contains all accessories for simultaneous processing 2 wafers with two different electroplating applications under one hood. The unit is fabricated with PVC and polypropylene and a minimum of metal parts to avoid potential contamination of electroplating solutions. Metal features are stainless and titanium. All parts can be easily disassembled for maintenance.

The station's unique arrangement for substrate preparation, specialized wafer holders, reciprocating anodes, programmable reverse pulse rectifiers and pumps ensure surpassing performance:

The unit is designed so that each anode/wafer holder set can be individually operated in a dedicated IKoCLASSIC module without interrupting the processing of the other.

  • Wafer holders, ergonomically designed for easy processing and handling. A full-circle, elastic electric gasket/contact provides uniform current distribution. Result: uniform thickness features across the wafer without leaking solution to the back of the wafer.

  • Reciprocating anodes, a proprietary feature, provide for an efficient exchange of matter and uniform electric field distribution for a wide range of substrate sizes and shapes.

  • Programmable reverse-pulse rectifiers contribute to equipment versatility with independent operating variable selection

  • Fan-out pumps with constant filtration (regardless of fine filter medium) provide a constant flow of high-quality bulk solution.
input power: 220/120 VAC +/-10%, 50-60 Hz, single phase, 15/30 A
hood size: 7’ W x 3’ D x 6’ H (construction material – Polypropylene)
wafer size: 2cm2 to 8"
metals plated: Cu, Ni, Pd, Au, Sn, Pb, Pt, Fe, Ag, Permalloy, Sn/Pb, Pd/Ni and others


2 Programmable Reverse Pulse Power Supplies

current avg: 0.1 A, 1 A, 3 A, 5 A, 10 A
current peak: 0.3 A, 3 A, 6 A,10 A, 20 A
volts: 0-10 V (higher voltages available)
programmable timer: 4 digit realtime


Electroplating Section

anode insoluble: two any size and shape from 2 cm2 up to 8" FIBRoplate™ anode
anode soluble: two any size and shape FIBRoplate™ baskets
wafer holder:

two any size and shape from 2cm2 up to 8" full circle gasket/contact, current collector

filtration: 2 continuous-cartridge, 400 GPH, 1 µ, filter systems
reciprocating frequency: 2 Independently controlled, 0 - 2.7 Hz
solution volume: Two 8 liter/2.1 Gal tanks



rinse tank: 10" x 12" x 12", cascade flow
conditioning tank: 10" x 10" x 12", two sections
ref. electrode: Ag/AgCl or calomel
add’l feature: two Luggin capillary attachments
N2/DI: Air/Nitrogen guns and DI water spray handy for wafer processing
spill prevention Solution containment tray for spill prevention

Start-Up Support

ECSI provides operating and maintenance manual and initial technical assistance and training as specified bellow:

a. Free of charge training at the Buyer’s location for first two (2) days;

b. Travel, room and board expenses paid by the Buyer for the first 2 (two) days at the Buyer's location;

c. At the prevailing hourly rate for any additional day beyond 2 (two) initial days.

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