The IKo-2W6 can simultaneously process any two wafers, 2" to 8" diameter, each with identical or totally independent hydrodynamic conditions and current control.

• micro/macro uniformity <5% across the wafer
• superior process control for sub-mil features
• low purchase and operating costs
• smallest bench-top twin-plater footprint on the market (40"X30")
• simultaneously processes two wafers 2" to 8" diameter
• capable of DC/RP running 1-15A average and 3-30A peak current
• equipped with FIBRotools wafer holders for uniform current up to 7.5A/piece
• thick deposits up to millimeter or more if needed
• extremely fast -- typically, 1-2µ per minute
• uses off-the-shelf chemistries with minimal additives
• efficiently reuses chemical solution
• easy to use/maintain

IKo-2W6 is fabricated with PVC and polypropylene and a minimum of metal parts to avoid potential contamination of electroplating solutions. Metal features are stainless and titanium. All parts can be easily disassembled for maintenance.

IKo-2W6 is made up of two sections:

Electroplating Section -- conveniently accessible while preparing wafers for plating
Control Box – raised over the Electroplating Section with two individual plating sections, one for each wafer.

IKo's arrangement of wafer holder, reciprocating anode, reverse pulse rectifier and pump ensure surpassing performance:

The unit is designed so that each anode/wafer holder set can be individually operated without interrupting the processing of the other wafer.

• Wafer holders, ergonomically designed for easy processing and handling. A full-circle, elastic electric gasket/contact provides uniform current distribution. Result: uniform thickness features across the wafer without leaking solution to the back of the wafer.
  
  
• Reciprocating anode, a proprietary feature. Provides for an efficient exchange of matter and uniform electric field distribution.
  
  
• Programmable reverse-pulse rectifier, contributes to equipment versatility in handling two individual wafers.
  
  
• Two fan-out pumps (400 GPH each) with constant filtration (regardless of fine filter medium). Provide a steady-state supply of high-quality bulk solution to each plating section.

input power:	220/120 VAC +/-10%, 50-60 Hz single phase line current 5.0/10.0 A
metals plated:	Cu, Ni, Pd, Pt, Au, Sn, Pb, Fe, Ag, Permalloy, Pd/Ni, Sn/Pb and others
	Programmable Reverse Pulse Power Supply Options Including:
current pulse avg:	1-15 A
current peak:	3-30 A
volts:	0-20
regulation accuracy:	±1% of setting or 0.1% of peak rating, whichever is greater
ripple:	< 1% RMS of maximum rated output voltage
timing:	Forward/Reverse XX.XXmS to XX.XX Seconds
on/off timing:	XX.XXmS to XX.XX Seconds
resolution:	xx.xx,xxx.x Min or Hours, xxx.x Seconds
frequency range:	0-5000Hz
anode insoluble:	any two 2" to 8" FIBRotools anodes with Pt/Ti.
anode soluble:	any two 2" to 8" FIBRotools titanium baskets with bags.
wafer holders:	any two 2" to 8" wafer holders, full circle contact each
filtration:	continuous-cartridge, 400 GPH, 1 µ
venting:	Fume exhaust attachment
heater:	two thermostats, 160F max., 550 Watt
rec. frequency:	0 – 2.7 Hz
solution volume:	16 liters
footprint:	40" wide, 30" deep (28" high)

Start-Up Support

ECSI provides operating and maintenance manual and initial technical assistance and training as specified bellow:

. a. Free of charge training at the Seller's or Buyer’s location for first two (2) days;

b. Travel, room and board expenses paid by the Buyer for the first 2 (two) days at the Buyer's location;

c. At the prevailing hourly rate for any additional day beyond 2 (two) initial days.