IKoClassic plus nano-wire templets preparation and nano-wire electroplating capability
- micro/macro uniformity <5% across the wafer
- superior process control for sub-mil features
- low purchase and operating costs
- smallest plater footprint on the market (26"X28")
- handles various-sized wafers (2" to 8")
- simultaneously processes up to three 2" wafers (can be customized to handle more)
- extremely fast -- typically, 1µ per minute
- uses off-the-shelf chemistries with minimal additives
- efficiently reuses chemical solution
- easy to use/maintain
FIBRoplate™ IKo™ is fabricated with PVC and polypropylene
and a minimum of metal parts to avoid potential contamination of
electroplating solutions. Metal features are stainless and titanium.
All parts can be easily disassembled for maintenance.
The unit is made up of two sections:
Electroplating Section -- conveniently accessible while preparing
wafers for plating.
Power Section -- rolls over the Electroplating Section for processing.
IKo's arrangement of wafer holder, reciprocating anode, reverse
pulse rectifier and pump ensure surpassing performance:
- Wafer holder, ergonomically designed for easy processing and handling. IKo can
accommodate various wafer sizes. A full-circle, elastic electric
contact provides uniform current distribution. Result: uniform
thickness features across the wafer.
- Reciprocating cathode and anode, a proprietary feature. Provides for
an efficient exchange of matter and uniform electric field distribution.
- Programmable Reverse-pulse rectifier, contributes to equipment versatility.
Reverse-pulse current during processing efficiently controls plating
thickness distribution along the Z-axis.
- Fan-out pump with
constant filtration (regardless of fine filter medium). Provides
a steady-state supply of high-quality bulk solution.
- Up to 50V pulse or reverse pulse well controlled anodizing.
- Up to 50V pulse or reverse pulse efficient nano-wire electroplating
| input power: | 220/120 VAC =/-10%, 50-60 Hz, 5/10A |
| wafer size: | 2" to 8" |
| metals plated: | Cu, Ni, Pd, Au, Sn, Pb, Pt, Fe, Ag, Permalloy, Sn/Pb, Pd/Ni and others |
| current pulse avg: | 1.0A |
| current peak: | 2.0A |
| volts: | 0-50V |
| control: | sealed keypad for setup of optional controls and features |
| on/off timing: | 4 digit 0.01 mS to 99 seconds |
| programmable timer: | 4 digit realtime |
| stability: | +/- 1mA |
| ripple: | less 1% |
| anode insoluble: | FIBRoplate™ anode |
| cathode insoluble: | stainless and other choices of metals |
| rec. frequency: | 0-2.7 Hz |
| wafer holder: | Full Circle gasket/contact, current collector |
| filtration: | Continuous-cartridge, 400 GPH with 1µ filtration |
| venting: | Fume exhaust attachment |
| heater: | Thermostat, 160F max., 550 Watt |
| solution volume: | 3.1 Gal, 8 liters |
| footprint: | 26" wide, 28" deep, 28" high |
Start-Up Support
ECSI provides operating and maintenance manual, installation (IKo CLASSIC and IKo 4W8 only) and initial technical assistance and training as specified bellow:
a. Free of charge training at the Seller's or Buyer’s location for first two (2) days;b. Travel, room and board expenses paid by the Buyer for the first 2 (two) days at the Buyer's location;
c. At the prevailing hourly rate for any additional day beyond 2 (two) initial days.