ECSI's IKo™ FIBRotools are designed for pure practicality. Simply put, they use ECSI proprietary FIBRoplate™ technology to consistently electroplate uniform high-resolution interconnects and fine metallic features on substrates and wafers. The ideal tools for electroplating microelectromechanical systems MEMS, NEMS and High Density Interconnects under controlled hydrodynamic conditions. Nothing fancy. We made them reliable, not pretty.

the base model powerhouse
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seedless plating
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electroplating under magnetic field
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allows multiple plating options
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allows multiple plating options
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a self-contained plating system
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same system, more options
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allows multiple plating options
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