The original IKo CLASSIC™ plus capability to electroplate MEMS and NANO structures with simultaneous presence of 1000 Oe magnetic field perpendicular to the plane of the substrate. Permanent magnet removable when not in use.
- micro/macro uniformity <5% across the wafer
- superior process control for sub-mil features
- enables electroplating under magnetic field if needed
- low purchase and operating costs
- smallest electroplater footprint on the market (26"X28")
- handles various-sized wafers (2" to 8")
- simultaneously processes up to three 2" wafers
- extremely fast -- typically, 1µ per minute
- uses off-the-shelf chemistries with minimal additives
- efficiently reuses chemical solution
- easy to use/maintain
IKoCLASSIC-MG is fabricated with PVC and polypropylene
and a minimum of metal parts to avoid potential contamination of electroplating
solutions. Metal features are stainless and titanium. All parts can be
easily disassembled for maintenance.
The unit is made up of two sections:
Electroplating Section -- conveniently accessible while preparing wafers
for plating.
Power Section -- rolls over the Electroplating Section for processing.
IKo's arrangement of wafer holder, reciprocating anode, reverse pulse
rectifier and pump ensure surpassing performance:
- Wafer holder, ergonomically designed for easy processing
and handling. IKo can accommodate various wafer sizes. A full-circle,
elastic electric contact provides uniform current distribution. Result:
uniform thickness features across the wafer.
- Reciprocating anode, a proprietary feature. Provides
for an efficient exchange of matter and uniform electric field distribution.
- Programmable Reverse-pulse rectifier, contributes
to equipment versatility.
Reverse-pulse current during processing efficiently controls plating thickness distribution along the Z-axis.
- Fan-out pump with constant filtration (regardless
of fine filter medium). Provides a steady-state supply of high-quality
bulk solution.
- Permanent magnet delivering 1000 Oe to the electroplating plane. Can be removed when not in use.
| input power: | 220/120 VAC =/-10%, 50-60 Hz, 5/10A |
| wafer size: | 2" to 8" |
| metals plated: | Cu, Ni, Pd, Au, Sn, Pb, Pt, Fe, Ag, Permalloy, Sn/Pb, Pd/Ni and others |
| current DC and pulse avg: | 0.1A, 1.0A and 3.0A |
| current peak: | 0.3A, 3.0A and 6.0A |
| volts: | 0-10 |
| control: | sealed keypad for setup of optional controls and features |
| on/off timing: | 4 digit 0.01 mS to 99 seconds |
| programmable timer: | 4 digit realtime |
| stability: | +/- 1mA |
| ripple: | less 1% |
| anode insoluble: | FIBRoplate™ anode |
| anode soluble: | FIBRoplate™ titanium basket |
| rec. frequency: | 0-2.7 Hz |
| wafer holder: | Full Circle gasket/contact, current collector |
| filtration: | Continuous-cartridge, 400 GPH with 1µ filtration |
| venting: | Fume exhaust attachment |
| heater: | Thermostat, 160F max., 550 Watt |
| solution volume: | 2.1 Gal, 8 liters |
| footprint: | 26" wide, 28" deep, 28" high |
Start-Up Support
ECSI provides
operating and maintenance manual and initial technical assistance and
training as specified bellow:
a. Free of charge training
at the Seller's or Buyer’s location for first two (2) days;
b. Travel, room and board expenses paid by the Buyer for
the first 2 (two) days at the Buyer's location;
c. At the prevailing hourly rate for
any additional day beyond 2 (two) initial days.