The MU-IKoSTATION™ is a self-contained multi-user complete plating system with three entirely separate IKo CLASSIC modules for MEMS and NANO fabrication, including wafer loading/unloading, cleaning and activation with DI rinsing and Nitrogen gun section. Easily retrofitted in a cleanroom environment.
- micro/macro uniformity <5% across the wafer
- superior process control for mil size and nano structures
- low purchase and operating costs
- simultaneously processing three any shape and size wafers(2 cm2 to 8")
- identical hydrodynamics for all sizes if needed
- extremely fast -- typically, 1µ per minute
- uses off-the-shelf chemistries with minimal additives
- efficiently reuses chemical solution
- easy to use/maintain
The MU-IKoSTATION contains all accessories for simultaneous processing 3 wafers with three different electroplating applications under one hood. The unit is fabricated with PVC and polypropylene and a minimum of metal parts to avoid potential contamination of electroplating solutions. Metal features are stainless and titanium. All parts can be easily disassembled for maintenance.
The station’s unique arrangement for substrate preparation, specialized wafer holders, reciprocating anodes, programmable reverse pulse rectifiers and pumps ensure surpassing performance:
The unit is designed so that each anode/wafer holder set can be individually operated in a dedicated IKoCLASSIC module without interrupting the processing of the others.
- Wafer holders, ergonomically designed for easy processing and handling. A full-circle, elastic electric gasket/contact provides uniform current distribution. Result: uniform thickness features across the wafer without leaking solution to the back of the wafer.
- Reciprocating anodes, a proprietary
feature, provides for an efficient exchange of matter and uniform
electric field distribution for a wide range of substrate sizes and
shapes.
- Programmable reverse-pulse rectifiers contribute to equipment versatility with independent operating variable selection
- Fan-out pumps with constant filtration (regardless of fine filter medium) provides a steady-state supply of high-quality bulk solution.
| input power: | 220/120 VAC +/-10%, 50-60 Hz, single phase, 15/30 A | |
| hood size: | 6.5’ W x 3’ D x 6’ H (construction material – Polypropylene) | |
| wafer size: | 2cm2 to 8" | |
| metals plated: | >Cu, Ni, Pd, Au, Sn, Pb, Pt, Fe, Ag, Permalloy, Sn/Pb, Pd/Ni and others | |
3 Programmable Reverse Pulse Power Supplies |
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| current avg: | 0.1 A, 1 A, 3 A, 5 A, 10 A |
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| current peak: | 0.3 A, 3 A, 6 A,10 A, 20 A |
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| volts: | 0-10 V (higher voltages available) |
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| programmable timer: | 4 digit realtime |
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Electroplating Section |
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| anode insoluble: | Three any size and shape from 2 cm2 up to 8" FIBRoplate™ anode | |
| anode soluble: | Three any size and shape FIBRoplate™ baskets | |
| wafer holder: |
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| filtration: | 3 continuous-cartridge, 400 GPH, 1 µ, filter systems |
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| reciprocating frequency: | 3 independently controlled, 0 – 2.7 Hz | |
| solution volume: | Three 8 liter/2.1 Gal tanks | |
Accessories |
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| rinse tank: | 10" x 12" x 12", cascade flow | |
| conditioning tank: | 10" x 10" x 12", two sections | |
| ref. electrode: | Ag/AgCl or calomel | |
| add’l feature: | three Luggin capillary attachments | |
| N2/DI: | Air/Nitrogen gun and DI water spray | |
| spill prevention | Solution containment tray for spill prevention |
Start-Up Support
ECSI provides
operating and maintenance manual and initial technical assistance and
training as specified bellow:
a. Free of charge training
at the Seller's or Buyer’s location for first two (2) days;
b. Travel, room and board expenses paid by the Buyer for
the first 2 (two) days at the Buyer's location;
c. At the prevailing hourly rate for
any additional day beyond 2 (two) initial days.