The original IKo CLASSIC™ plus capability to electroplate directly on doped silicon, resistance 5e-3 ohm-cm or less. Electroplating uniformity enabled with proprietary wafer holder design.

• micro/macro uniformity <5% across the wafer
• seedless electroplating capability
• superior process control for sub-mil features
• low purchase and operating costs
• smallest plater footprint on the market (26"X28")
• handles various-sized wafers (2" to 8")
• simultaneously processes up to three 2" wafers
• extremely fast -- typically, 1µ per minute
• uses off-the-shelf chemistries with minimal additives
• efficiently reuses chemical solution
• easy to use/maintain

IKO CLASSIC-SL is fabricated with PVC and polypropylene and a minimum of metal parts to avoid potential contamination of electroplating solutions. Metal features are stainless and titanium. All parts can be easily disassembled for maintenance.

The unit is made up of two sections:

Electroplating Section -- conveniently accessible while preparing wafers for plating.
Power Section -- rolls over the Electroplating Section for processing.

IKo's arrangement of wafer holder, reciprocating anode, reverse pulse rectifier and pump ensure surpassing performance:

•  Wafer holder, ergonomically designed for easy processing and handling. IKo can accommodate various wafer sizes. A full-circle, elastic electric contact provides uniform current distribution. Result: uniform thickness features across the wafer.
  
  
• Reciprocating anode, a proprietary feature. Provides for an efficient exchange of matter and uniform electric field distribution.
  
  
• Programmable Reverse-pulse rectifier, contributes to equipment versatility. Reverse-pulse current during processing efficiently controls plating thickness distribution along the Z-axis.
  
  
• Fan-out pump with constant filtration (regardless of fine filter medium). Provides a steady-state supply of high-quality bulk solution.
  
  
• Seedless Electroplating option with doped Silicon substrates resistance 5e-3 ohm-cm and less – enabled with proprietary wafer holder design.

input power:	220/120 VAC =/-10%, 50-60 Hz, 5/10A
wafer size:	2" to 8"
metals plated:	Cu, Ni, Pd, Au, Sn, Pb, Pt, Fe, Ag, Permalloy, Sn/Pb, Pd/Ni and others
current DC and pulse avg:	0.1A, 1.0A and 3.0A
current peak:	0.3A, 3.0A and 6.0A
volts:	0-10
control:	sealed keypad for setup of optional controls and features
on/off timing:	4 digit 0.01 mS to 99 seconds
programmable timer:	4 digit realtime
stability:	+/- 1mA
ripple:	less 1%
anode insoluble:	FIBRoplate™ anode
anode soluble:	FIBRoplate™ titanium basket
rec. frequency:	0-2.7 Hz
wafer holder:	FIBRotoolsTM design for seedless plating
filtration:	Continuous-cartridge, 400 GPH with 1µ filtration
venting:	Fume exhaust attachment
heater:	Thermostat, 160F max., 550 Watt
solution volume:	2.1 Gal, 8 liters
footprint:	26" wide, 28" deep, 28" high

Start-Up Support

ECSI provides operating and maintenance manual and initial technical assistance and training as specified bellow:

a. Free of charge training at the Seller's or Buyer’s location for first two (2) days;

b. Travel, room and board expenses paid by the Buyer for the first 2 (two) days at the Buyer's location;

c. At the prevailing hourly rate for any additional day beyond 2 (two) initial days.